讲师姓名:	宋复斌
专长领域：	生产管理
内训预约：	（仅服务企业终端，培训同行勿扰）

● 讲师介绍：
宋复斌, 博士, 于2002年和2007年在北京航空航天大学（BUAA）和香港科技大学（HKUST）分别获得材料学硕士及机械工程博士学位。2002-2004年之间，他任职于摩托罗拉半导体事业部（现为飞思卡尔半导体）从事电子产品封装方面的开发及研制。2004-2012年之间，宋复斌博士在香港科技大学先进微系统封装中心电子封装实验室任职为资深/总工程师和香港科大深圳电子材料与封装实验室的资深研究员。他的研究领域覆盖了封装材料的开发测试、电子器件的可靠性研究和失效分析等。目前主要负责先进制造工程和质量改善解决方案等工作。宋博士是美国国际电机电子工程师学会（IEEE）, 表面组装技术协会(SMTA) 和美国机械工程师学会（ASME）会员，以及美国质量学会(ASQ)的资深会员。他在国内外学术期刊及会议论文集上发表了超过50篇技术论文并多次获得最佳论文奖，且与其他研究学者合作撰写了两本微电子封装与组装方面的书章。
Dr. Fubin SONG received his Ph.D degree in Mechanical Engineering from the Hong Kong University of Science & Technology (HKUST) in 2007 and M.S. degree in Material Science & Engineering from Beijing University of Aeronautics and Astronautics (BUAA) in 2002. From 2002 to 2004, he was with Division of Motorola s Semiconductor Products Sector (now Freescale Semiconductor) in advanced electronic packaging and development. From 2004 to 2012, Dr. Song was the senior / chief technical officer in Center for Advanced Microsystems Packaging (CAMP)/Electronic Packaging Laboratory (EPACK)/HKUST, responsible for advanced packaging related process development, failure analysis and solder joint reliability. He also served as a senior research fellow of HKUST Shenzhen Electronic Materials & Packaging Laboratory from 2009 to 2012. Currently, responsible for advanced engineering and quality solution. He has published over 50 technical papers in international journals/conferences and received several best paper awards, including Best International Conference Paper Award from IPC APEX, Outstanding Paper Award from ICEP, and Best Paper Award of SMTA China South Technology Conference 2011, etc. He also wrote two chapters for books on the solder joint reliability.