| 讲师姓名: | 李宁成 |
| 专长领域： | 质量管理 |
| 内训预约： | （仅服务企业终端，培训同行勿扰） |
李宁成博士 1986年至今，任职于美国铟科技公司，现任该公司副总裁。在此之前，任职于Wright Patterson空军基地材料实验室（1981-1982），Morton化学（1982-1984）和SCM（1984-1986）。他在SMT助焊剂和焊锡膏方面有20多年的研究经验。此外，他在底部填充胶和粘接剂方面有着丰富的经验。现今，他的研究领域涉及到电子和光电子的互联与封装应用的先进材料，并且侧重于高性能与低成本。
李宁成博士于1981年在美国阿克伦城大学获得结构-性质关系聚合体科学博士学位。1976年，他在Rutgers 大学专修有机化学。1973年他在台湾国立大学获得化学学士学位。
李宁成博士最新出版了《再流焊工艺和缺陷侦断：SMT，BGA，CSP和Flip Chip技术》。合著编写了《无铅，无卤素和导电胶材料的电子制造》。同时，他还编写了一系列关于无铅焊接书籍的章节。他荣获SMTA两项大奖和一项SMT杂志的最佳国际会议论文奖。2002年荣获SMTA杰出会员，2003年荣获Soldertec的无铅合作奖。2006年荣获CPMT特殊技术成就奖。他就职于SMTA执行董事会。此外，他还是《焊接与表面组装技术》、《世界SMT与封装》的编辑顾问，和IEEE电子封装制造的副编辑。他有众多的出版物以及经常应邀在全世界许多国际会议或者讨论会上作学术报告，发表演讲和简短课程。
Ning-Cheng Lee is the Vice President of Technology of Indium Corporation of America. He has been with Indium since 1986. Prior to joining Indium, he was with Wright Patterson Air Force Base Materials Laboratory (1981-1982), Morton Chemical (1982-1984), and SCM (1984-1986). He has more than 20 years of experience in the development of fluxes and solder pastes for SMT industries. In addition, he also has very extensive experience in the development of underfills and adhesives. His current research interests cover advanced materials for interconnects and packaging for electronics and optoelectronics applications, with emphasis on both high performance and low cost of ownership.
He received his PhD in polymer science on structure-property relationships from University of Akron in 1981. Prior to Akron period, he has studied organic chemistry at Rutgers University in 1976. He received a BS in chemistry from National Taiwan University in 1973.
Ning-Cheng is the author of “Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP, and Flip Chip Technologies” by Newnes, and co-author of “Electronics Manufacturing with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials” by McGraw-Hill. He is also the author of book chapters for several lead-free soldering books. He received two awards from SMTA and one from SMT Magazine for best proceedings papers of international conferences. He is honored as 2002 SMTA Member of Distinction, and received 2003 Lead-Free Co-Operation Award from Soldertec, and received 2006 Exceptional Technical Achievement Award from CPMT. He serves on the board of director for SMTA. Among other editorial responsibilities, he serves as one of the editorial advisory boards of Soldering & Surface Mount Technology, Global SMT & Packaging, and as associate editor for IEEE Transactions on Electronics Packaging Manufacturing. He has numerous publications and frequently gives presentations, invited seminars, keynote speeches, and short courses worldwide on those subjects at many international conferences or symposiums.
